PART |
Description |
Maker |
PUMA2US2500I-2512 PUMA2US2500I-2510 PUMA2US2500I-2 |
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE) 10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE) 10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE) 10MS, 8 SOIC, IND TEMP, GREEN, 2.7(SERIAL EE) 10MS, 8 TSSOP, IND TEMP, GREEN, 2.7(SERIAL EE) 10MS, 8 TSSOP, EXT TEMP, GREEN, 2.7V(SERIAL EE) 10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE) 10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE) 10MS, 8 MINI-MAP, IND TEMP, GREEN, 1.8V(SERIAL EE) 10MS, 8 LAP, IND TEMP, GREEN, 2.7V(SERIAL EE) SRAM/EPROM 静态存储器/存储 10MS, DIE, 1.8V, 11 MILS THICKNESS(SERIAL EE) 静态存储器/存储
|
TDK, Corp. TE Connectivity, Ltd.
|
PUMA67S16000M-025 PUMA2S16000I-45 PUMA67S16000I-45 |
150NS, PLCC, COM TEMP(FLASH) 15NS, 44 PLCC, COM TEMP(EPLD) 30MHZ, 3.3V, 8 LAP, COM TEMP(FPGA) 20NS, 44 PLCC, COM TEMP(EPLD) 150NS, TSOP, IND TEMP(FLASH) 20NS, 44 TQFP, IND TEMP(EPLD) 120NS, SOIC, IND TEMP(EEPROM) 70NS, TSOP, IND TEMP(EEPROM) 15NS, 68 PLCC, IND TEMP(EPLD) 25NS, 68 PLCC, IND TEMP(EPLD) 30MHZ, 32 TQFP, COM TEMP(FPGA) 120NS, PDIP, IND TEMP(EEPROM) 32 MCROCELL CPLD 1.8V ISP TQFP IND GREEN(EPLD) x32 SRAM Module X32号的SRAM模块 90NS, TSOP, IND TEMP(EEPROM) X32号的SRAM模块 120NS, PLCC, IND TEMP(EEPROM)
|
DB Lectro, Inc. TE Connectivity, Ltd.
|
PUMA2X0211I-1570 PUMA2X0211M-9070 PUMA2X0211M-9085 |
10MS, 8 TSSOP, IND TEMP, GREEN, 1.8V(SERIAL EE) 10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE) 10MS, DIE 1.8V, 11 MILS THICKNESS(SERIAL EE) 10MS, 8 SOIC, COM TEMP(SERIAL EE) SRAM/EPROM 静态存储器/存储
|
Mitsubishi Electric, Corp.
|
AM29LV800BB-120WBI AM29LV800BB-120WBC AM29LV800BB- |
30MHZ, 3.3V, 44 TQFP, IND TEMP(FPGA) 30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA) 30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA) 8-TSSOP,AUTO,Pb/HALO FREE,NIPDAU LF 2.5V(SERIAL EE) 10MHZ, 20 SOIC, COM TEMP, 5K MOQ(FPGA) 10MHZ, 20 SOIC, IND TEMP, 5K MOQ(FPGA) 30MHZ, 3.3V, 44 PLCC, COM TEMP(FPGA) 30MHZ, 3.3V, 44 TQFP, COM TEMP(FPGA) 30MHZ, 8 LAP, IND TEMP, GREEN(FPGA) x8/x16闪存EEPROM x8/x16 Flash EEPROM x8/x16闪存EEPROM 32M CONFIG FLASH, 44 PLCC, GREEN(FPGA) x8/x16闪存EEPROM 512K X 16 FLASH 3V PROM, 120 ns, PDSO44 512K X 16 FLASH 3V PROM, 120 ns, PDSO48 10MHZ, 8 PDIP, COM TEMP, 5K MOQ(FPGA)
|
Analog Devices, Inc. ADVANCED MICRO DEVICES INC
|
AM29SL800CB-100WBI AM29SL800CT-100WBC AM29SL800CT- |
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7V(SERIAL EE) x8/x16闪存EEPROM x8/x16 Flash EEPROM x8/x16闪存EEPROM 10MS, 8 PDIP, IND TEMP, GREEN, 2.7V(SERIAL EE) x8/x16闪存EEPROM 10MS, 8 SOIC, IND TEMP, GREEN, 1.8V(SERIAL EE) x8/x16闪存EEPROM
|
Spansion, Inc. GE Security, Inc. Amphenol, Corp. STMicroelectronics N.V. Lattice Semiconductor, Corp.
|
AM9114CDCB AM91L14E/BVA AM9114EPC AM9114C/BVA AM91 |
x4 SRAM 15NS, OTP, PLCC, EXT TEMP, ROHS-A(EPLD) 5V, 20MHZ, SOIC, IND TEMP, GREEN(MCU AVR) QTR PWR,250NS,CERDIP,883C;LEV B(EPLD) x4的SRAM 25NS, OTP, PLCC, IND TEMP(EPLD) x4的SRAM 25NS, OTP, PDIP, COM TEM(EPLD) x4的SRAM
|
Linear Technology, Corp. Rohm Co., Ltd.
|
PUMA2S4000L-55 PUMA2S4000I-45 PUMA2S4000M-55 PUMA2 |
10MHZ, 8 DIP, IND TEMP(FPGA) 10MHZ, 20 SOIC, 5K MOQ(FPGA) 30MHZ, 3.3V, 44 PLCC, COM TEMP(FPGA) 10MHZ, 8 SOIC, IND TEMP, 5K MOQ(FPGA) X32号的SRAM模块 10MHZ, 20 PLCC, COM TEMP(FPGA) X32号的SRAM模块
|
L-com, Inc.
|
ADA4891-3ARU-EBZ ADA4891-4ARU-EBZ ADA4891-1ARJ-EBZ |
Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers, Package: MICRO SOIC, 8 Pin, Ind Temp -40°C – 125 °C, 7" Tape and Reel MSOP RM-8 H1U OP-AMP, PDSO8 Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers, Package: SOIC 150 MIL, 8 Pin, Ind Temp -40°C – 125 °C, 7" Tape and Reel R-8 OP-AMP, PDSO8 Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers, Package: SOIC 150 MIL, 8 Pin, Ind Temp -40°C – 125 °C, 13" Tape and Reel R-8 OP-AMP, PDSO8 Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers, Package: MICRO SOIC, 8 Pin, Ind Temp -40°C – 125 °C, MSOP 13" Tape and Reel RM-8 H1U OP-AMP, PDSO8 Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers , Package: SOIC 150 MIL, 8 Pin, Temp: Ind -40°C – 125 °C OP-AMP, PDSO8 Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers , Package: SOIC 150 MIL, 8 Pin, Temp: Ind -40°C – 125 °C, 7" Tape and Reel R-8 Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers , Package: SOT23 5/6/8 Leads, 5 Pin, Temp: Ind -40°C – 125 °C, 13" Tape and Reel RJ-5 H1W Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers, Package: MICRO SOIC, 8 Pin, Ind Temp -40°C – 125 °C, MSOP RM-8 H1U
|
Analog Devices, Inc. ANALOG DEVICES INC
|
ISC1812BN8R2K ISC1812ES4R7K ISC1812BN1R5J ISC1812E |
General Fixed Inductor, IND,POWDERED IRON,8.2UH,10% TOL,10% -TOL,1812 CASE General Fixed Inductor, 1 ELEMENT, 4.7 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 1812, HALOGEN FREE AND ROHS COMPLIANT General Fixed Inductor, IND,POWDERED IRON,1.5UH,5% TOL,5% -TOL,1812 CASE General Fixed Inductor, IND,FERRITE,120UH,5% TOL,5% -TOL,1812 CASE General Fixed Inductor, IND,FERRITE,560UH,5% TOL,5% -TOL,1812 CASE General Fixed Inductor, IND,FERRITE,270UH,10% TOL,10% -TOL,1812 CASE General Fixed Inductor, IND,POWDERED IRON,22UH,5% TOL,5% -TOL,1812 CASE ISC-1812 Wirewound, Surface Mount, Molded, Shielded Inductors IND CHIP SHLD/MLD 330NH 5% 25.2MHZ 30Q-FCTR 394MA 1812 - Bulk IND CHIP SHLD/MLD 150NH 20% 25.2MHZ 30Q-FCTR 491MA 1812 - Tape and Reel General Fixed Inductor, IND,POWDERED IRON,10UH,10% TOL,10% -TOL,1812 CASE
|
Vishay Dale
|
|